Billerica, MA. April 22, 2009 - Amphenol Advanced Sensors today announced the release of 10 pressure sensing MEMS die families from the company’s robust suite of sensors for qualified volume OEM customers. These products include highly specialized die for Healthcare, Transportation, Industrial and Process control applications.
“This marks the first time Amphenol Advanced Sensors has offered these lines of high stability pressure sensing die for general sale,” said Brian Wirth, MEMS Global Product Manager. “This reflects our commitment to serve an expanded OEM sensor market by offering these proven products at cost effective pricing.”
The 10 families of sensing die are in pressure ranges and sizes to fit most OEM sensor applications. Pressure ranges are available from 0 to 10 Inches H20 (25mbar) up to 10,000PSI (25bar) in Absolute, Gage, Differential, or Sealed Gage versions. Die are also offered with or without glass constraint to enable customers to further isolate the sensing die and meet dimensional height requirements for existing packaging.
For example, the P161 and P165 die families are intended for healthcare catheter tip pressure sensors. These die are produced using Amphenol Advanced Sensors' proven Silicon Bonding process technology, which results in an ultra small 675 micron width die for catheter applications. Also released is the P1302 line of high stability/high sensitivity pressure die. The P1302 10inch H20 low pressure die has been an industry benchmark for applications that require high sensitivity (typically 75mV), high overpressure (20X rated full scale), accuracy better than +/-0.5%FS and feature superior isolation from mounting affects.
Amphenol Advanced Sensors also produces custom versions of pressure sensing die and provides foundry service for process-ready products. Customers are encouraged to contact the factory for more information and visit the Amphenol Advanced Sensors Web site for a comprehensive view of all MEMS products and services.