Thermometrics Type PRE/K Series

Glass-encapsulated ThermistorThin-Film Platinum Resistance Elements.

 

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Features

  • Small dimensions available
  • High electrical insulation is guaranteed by non-conductive edges and sides
  • Short response times

Applications

  • Especially suited for surface measurement
  • Installation on printed circuit boards
  • Application in the auto industry, domestic appliances
  • Resistance elements selected in tolerance groups for calorimetry
  • Large quantity applications NTC Types

Specifications

Description

A ceramic substrate supports a structured platinum layer covered with glass. The connection lead contacts are shear force resistant.

Options

Special versions on request. (Please take into account longer delivery time and minimum order quantity). Examples of possible variations are:

  • Narrower IEC tolerances (indicate measurement point or range)
  • Temperature up to 1112°F (600°C)
  • Metallizations of the back of the substrate
  • Longer or shorter connection wires
  • Connection wires in opposite direction: U shape or S shape (chip surface completely covered with fixation paste for improved wire connection)
  • Silver connection leads (∅0.3 mm) which allows an easy soft solder (temperature range -94°F to 482°F (-70°C to 250°C))
  • Extension of the connection wires with all types of cables.

Data

Nominal Resistance Value 100 Ω, 500 Ω, 1000 Ω at 32°F (0°C)
Tolerance Grade A and B according to IEC 751 and narrower tolerances in restricted temperature ranges. (-40°F to 302°F (-40°C to 150°C))
Temperature Range -94°F to 932°F (-70°C to 500°C)
Connection Material Platinum coated nickel wire
Temperature Stability Slight hysteresis possible after temperature shocks.
Vibration Resistance High resistance to vibration and shocks.
Mechanical Stability Insensitive to varying pressure, but sensitive to twisting and bending. Care must be taken when housing the elements; excessive stress may affect nominal resistance.
Environmental Conditions Unhoused, for dry environment only.

 

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